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Engineering (for) Electromagnetic Compatibility                

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ELECTROMAGNETIC-COMPATABILITY CONSULTATION SERVICES

We can discuss and perhaps offer suggestions or recommendations to your design group or PC board designer with regard to the design techniques and "good practices" executed and applied during the design of the printed circuit board, component placement, trace routing and layout.  Observing the proper design techniques while the product is still in the design stage will usually reduce the severity and lower the likelihood of excessive radiated emissions occurring when testing the circuit for conformance to the emission standards.

For example, our recommendations with respect to usage of the PC  board "real estate" may help improve the crosstalk response of the module, and reduce additional sources of noise and interference radiating from the circuit electronics.  Steps taken to improve the digital ground (DGND) and power supply signal integrities (VDD) may help reduce the 'pesty' signal coupling; subsequently lowering the magnitude of the noise power density (NPD) at the voltage output of the integrated circuit (IC) being used for the voltage reference.  Of course, this reference voltage accommodates the highly noise-sensitive group of analog-to-digital (A/D) converters in the circuit ... (as we remain cognizant of the fan-out limitations of the logic family that we are using).



BONUS: Download our white paper on PCB Design Guidelines right now!


CTI_White_Paper-PCB_Design_Guidelines.pdf CTI_White_Paper-PCB_Design_Guidelines.pdf




There are a number of areas of concern that directly affect the signal integrity and the electromagnetic compatibility of the end product.  We can lend our expertise in a number of areas:

Cipher Technologies offers consulting services with regard to 'good-practice'  circuit design techniques and physical layout guidelines for  high-speed, high-density multilayer printed circuit boards (PCBs), printed wiring boards (PWBs) and circuit card assemblies (CCAs).
Design Techniques for Noise Suppression

Electromagnetic Interference (EMI / RFI) Minimization

Electrostatic Discharge (ESD) Minimization

Electromagnetic Compatibility (EMC) Design Rules

Electromagnetic Noise Generation and Containment

Potential Photoelectric Effects

Circuit Noise Coupling and Decoupling

Inductive Signal Coupling

Grounding and Signal Routing

Good Grounding Practices

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Magnetic Shielding

Use of Star (Mecca) Grounds

System and Earth Grounds

Phase-Noise and Clock Jitter Effects

Power Supply Noise

Power Supply Line Coupling and Decoupling

Logic Fan-Out Guidelines

Digital Logic Timing Errors and Variations

LSI and VLSI Logic Noise
(Current Spikes and Large dV/dT Output Swings)

Meeting EMI / RFI Emission Regulations   
(USA: FCC-15 Part J)

Additional Radio Frequency Interference Considerations (RFI)

IPC-2221 Generic Standard on Printed Board Design
(Institute for Interconnecting and Packaging Electronic Circuits)

IPC-D-330 Design Guide
(Institute for Interconnecting and Packaging Electronic Circuits)



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Please contact us at 1-847-680-9147 or electronically mail our Technical Assistance group in care of : chief_engr@ciphertechnologiesinc.com.  We are here to assist you with any questions of a technical nature or to discuss your particular application/requirement and just how we may assist you.  We are at your service!

©2000-2006 Cipher Technologies, Inc. All rights reserved.

noise, interference, radio frequency emissions, electromagnetic compatibility, printed circuit design, RFI, bypass capacitor, coupling, bypass, high-frequency emissions, regulation, electromagnetic interference, EMI, EMC, crosstalk, choke, noise-reduction, jitter, phase-noise, ESD, jitter, phase-noise, overtones,  harmonics, electrostatic discharge, suppression, dBV, dB, decibel, dBuV, figure-of-merit, signal-to-noise, SNR, noise figure