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"The Art & Science of 'Intelligent EngineeringTM"
ELECTROMAGNETIC-COMPATABILITY CONSULTATION SERVICES
We can discuss and perhaps offer suggestions or recommendations to your design group or PC board designer with regard to the design techniques and "good practices" executed and applied during the design of the printed circuit board, component placement, trace routing and layout. Observing the proper design techniques while the product is still in the design stage will usually reduce the severity and lower the likelihood of excessive radiated emissions occurring when testing the circuit for conformance to the emission standards.
For example, our recommendations with respect to usage of the PC board "real estate" may help improve the crosstalk response of the module, and reduce additional sources of noise and interference radiating from the circuit electronics. Steps taken to improve the digital ground (DGND) and power supply signal integrities (VDD) may help reduce the 'pesty' signal coupling; subsequently lowering the magnitude of the noise power density (NPD) at the voltage output of the integrated circuit (IC) being used for the voltage reference. Of course, this reference voltage accommodates the highly noise-sensitive group of analog-to-digital (A/D) converters in the circuit ... (as we remain cognizant of the fan-out limitations of the logic family that we are using).
BONUS: Download our white paper on PCB Design Guidelines right now!
There are a number of areas of concern that directly affect the signal integrity and the electromagnetic compatibility of the end product. We can lend our expertise in a number of areas:
Cipher Technologies offers consulting services with regard to 'good-practice' circuit design techniques and physical layout guidelines for high-speed, high-density multilayer printed circuit boards (PCBs), printed wiring boards (PWBs) and circuit card assemblies (CCAs).
Design Techniques for Noise Suppression
Electromagnetic Interference (EMI / RFI) Minimization
Electrostatic Discharge (ESD) Minimization
Electromagnetic Compatibility (EMC) Design Rules
Electromagnetic Noise Generation and Containment
Potential Photoelectric Effects
Circuit Noise Coupling and Decoupling
Inductive Signal Coupling
Grounding and Signal Routing
Good Grounding Practices
Magnetic Shielding
Use of Star (Mecca) Grounds
System and Earth Grounds
Phase-Noise and Clock Jitter Effects
Power Supply Noise
Power Supply Line Coupling and Decoupling
Logic Fan-Out Guidelines
Digital Logic Timing Errors and Variations
LSI and VLSI Logic Noise
(Current Spikes and Large dV/dT Output Swings)
Meeting EMI / RFI Emission Regulations
(USA: FCC-15 Part J)
Additional Radio Frequency Interference Considerations (RFI)
IPC-2221 Generic Standard on Printed Board Design
(Institute for Interconnecting and Packaging Electronic Circuits)
IPC-D-330 Design Guide
(Institute for Interconnecting and Packaging Electronic Circuits)
Please contact us at 1-847-680-9147 or electronically mail our Technical Assistance group in care of : chief_engr@ciphertechnologiesinc.com. We are here to assist you with any questions of a technical nature or to discuss your particular application/requirement and just how we may assist you. We are at your service!
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noise, interference, radio frequency emissions, electromagnetic compatibility, printed circuit design, RFI, bypass capacitor, coupling, bypass, high-frequency emissions, regulation, electromagnetic interference, EMI, EMC, crosstalk, choke, noise-reduction, jitter, phase-noise, ESD, jitter, phase-noise, overtones, harmonics, electrostatic discharge, suppression, dBV, dB, decibel, dBuV, figure-of-merit, signal-to-noise, SNR, noise figure